3-Dimensional VLSI

A 2.5-Dimensional Integration Scheme
Buch | Hardcover
200 Seiten
2010 | 2010
Springer Berlin (Verlag)
978-3-642-04156-3 (ISBN)
149,79 inkl. MwSt
lt;p>"3-Dimensional VLSI: A 2.5-Dimensional Integration Scheme"elaborates the concept and importance of 3-Dimensional (3-D) VLSI. The authors have developed a new 3-D IC integration paradigm, so-called 2.5-D integration, to address many problems that are hard to resolve using traditional non-monolithic integration schemes. The book also introduces major 3-D VLSI design issues that need to be solved by IC designers and Electronic Design Automation (EDA) developers. By treating 3-D integration in an integrated framework, the book provides important insights for semiconductor process engineers, IC designers, and those working in EDA R&D.

Dr. Yangdong Deng is an associate professor at the Institute of Microelectronics, Tsinghua University, China. Dr. Wojciech P. Maly is the U. A. and Helen Whitaker Professor at the Department of Electrical and Computer Engineering, Carnegie Mellon University, USA.

A Cost Comparison of VLSI Integration Schemes.- Design Case Studies.- An Automatic 2.5-D Layout Design Flow.- Floorplanning for 2.5-D Integration.- Placement for 2.5-D Integration.- A Road map of 2.5-D Integration.- Conclusion and Future Work.

Erscheint lt. Verlag 21.6.2010
Zusatzinfo 200 p. 50 illus.
Verlagsort Berlin
Sprache englisch
Maße 155 x 235 mm
Themenwelt Technik Elektrotechnik / Energietechnik
Schlagworte 2.5-D integration • 3-D integration • design automation • Electronic Design Automation • Integrated circuit • Integrated Circuits • semiconductor • TUP • Very-large-scale integration • VLSI • VLSI Design • VLSI IC
ISBN-10 3-642-04156-6 / 3642041566
ISBN-13 978-3-642-04156-3 / 9783642041563
Zustand Neuware
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