3D Microelectronic Packaging

From Fundamentals to Applications

Yan Li, Deepak Goyal (Herausgeber)

Buch | Hardcover

IX, 463 Seiten

2017 | 1st ed. 2017
Springer International Publishing (Verlag)
978-3-319-44584-7 (ISBN)

Titel erscheint in neuer Auflage

Artikel merken

Zu diesem Artikel existiert eine Nachauflage

3D Microelectronic Packaging

Yan Li, Deepak Goyal

2020

Buch | Hardcover

181, ⁸⁹ €

zur Neuauflage

This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.

Introduction to 3D Microelectronic Packaging.-3D packaging architecture and assembly process design.-Materials and Processing of TSV.-Microstructural and Reliability Issues of TSV.- Fundamentals and failures in Die preparation for 3D packaging.-Direct Cu to Cu bonding and other alternative bonding techniques in 3D packaging.- Fundamental of Thermal Compression Bonding Technology and Process Materials for 2.5/3D Packages .- Fundamentals of solder alloys in 3D packaging.-Fundamentals of Electromigration in interconnects of 3D packages.-Fundamentals of heat dissipation in 3D IC packaging.- Fundamentals of advanced materials and processes in organic substrate technology.- Die and Package Level Thermal and Thermal/Moisture Stresses in 3-D Packaging: Modeling and Characterization.- Processing and Reliability of Solder Interconnections in Stacked Packaging.- Interconnect Quality and Reliability of 3D Packaging.- Fault isolation and failure analysis of 3D packaging.

Erscheinungsdatum	08.02.2017
Reihe/Serie	Springer Series in Advanced Microelectronics ; 57
Zusatzinfo	IX, 463 p. 331 illus., 253 illus. in color.
Verlagsort	Cham
Sprache	englisch
Maße	155 x 235 mm
Themenwelt	Technik ► Elektrotechnik / Energietechnik
Schlagworte	3D microelectronic packages • Advanced materials in 3D packages • Electronic Circuits and Devices • Electronic devices and materials • Electronics and Microelectronics, Instrumentation • Electronics: circuits and components • Electronics engineering • Engineering • Failure analysis microelectronic packaging • Heat dissipation • Industrial chemistry and chemical engineering • Metallic and polymeric packaging materials • Metallic materials • metals technology / metallurgy • Micro bumps • microengineering • Nanotechnology and Microengineering • optical and electronic materials • other manufacturing technologies • Quality and Reliability of 3D Packaging • Solder connects in 3D packages • Through-Silicon Via • TSV Processing and Reliability
ISBN-10	3-319-44584-7 / 3319445847
ISBN-13	978-3-319-44584-7 / 9783319445847
Zustand	Neuware