Microchip Fabrication, 5th Ed.
McGraw-Hill Professional (Verlag)
978-0-07-143241-2 (ISBN)
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New to this edition is: nanotechnology; 300-mm wafer processing; "Green" processes and devices; and new fabrication advances. This is the No.1 book in the industry - completely revised and updated. A perfect introduction to the industry that drives high tech, "Microchip Fabrication" offers a low-math, straight-talk approach to the entire process of semiconductor processing - from raw materials through shipping the finished, packaged device. With lots of detailed illustrations and analogies to everyday life, this is the industry's most novice-friendly text!Used for training, teaching, and vocational-technical programs, "Microchip Fabrication" covers every stage of semiconductor processing, from raw material preparation to packaging and testing and traditional and state-of-the-art processes. Each chapter contains quizzes and review summaries buttressed by an extensive glossary. By the time you've finished "Microchip Fabrication", you'll have a solid working knowledge of the important issues and processes and materials and methods involved in semiconductor technology, whether on the subatomic level or in the context of large-scale industrial practices. Review: "...An excellent reference for anyone who wishes to know more about the technical side of semiconductor manufacturing.
It is well-indexed, and the chapters are self-contained enough to make it useful for catching up on one topic at a time." - FabTime, on the previous edition.
Peter Van Zant is the Principal of Peter Van Zant Associates, a semiconductor manufacturing consulting and training company, and the author of all three previous editions of this widely read book. He has over 35 years in the semiconductor industry, working at IBM, Texas Instruments, and National Semiconductors. He resides in Grass Valley, California.
The Semiconductor IndustryInternational Technology Roadmap for SemiconductorsSemiconductor Materials and Process ChemicalsManufacturing WafersOverview of Wafer Fabrication300mm wafer diameter processingContamination ControlProcess YieldsNanotechnology ProcessesOxidationBasic Patterning -- Surface Preparation to ExposureBasic Patterning -- Developing to Final InspectionAdvanced Photolithography ProcessesDopingDeposition of Dielectrics and Semiconductor LayersMetalization: Wiring the Chip CompositesProcess and Device EvaluationThe Business of Water FabricationGreen ProcessingSemiconductor Devices and Integrated Circuit FormationNanotechnology DevicesIntegrated Circuit TypesPackagingGLOSSARY
Erscheint lt. Verlag | 16.6.2004 |
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Zusatzinfo | 200 Illustrations, unspecified |
Sprache | englisch |
Maße | 158 x 231 mm |
Gewicht | 980 g |
Themenwelt | Technik ► Elektrotechnik / Energietechnik |
ISBN-10 | 0-07-143241-8 / 0071432418 |
ISBN-13 | 978-0-07-143241-2 / 9780071432412 |
Zustand | Neuware |
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