Electronic Packaging and Interconnection Handbook

Charles A. Harper is president of Technology Seminars, Inc., an organization devoted to presenting seminars on electronic packaging and related subjects to the electronics industry. He is a graduate of The John Hopkins University School of Engineering , Baltimore, MD., and a past member of the engineering faculty of The Johns Hopkins University. He is active in numerous professional societies, including the International Microelectronics and Packaging Society (of which he is a past president), the National Electronic Packaging Conference (NEPCON), and the Institute of Electrical and Electronics Engineers. He is series editor of McGraw-Hill's Electronic Packaging and Interconnection Technology Series and a member of the Editorial Advisory Board of Electronic Packaging and Production magazine.

Materials for Electronic Packaging. Thermal Management in Electronic Packaging. Mechanical and Thermomechanical Stress Behavior in Electronic Packaging. Connector and Interconnection Technology. Wiring and Cabling. Soldering and Solder Technology. Integrated Circuit Packaging and Ball Grid Arrays. Surface Mount Technologies. Hybrid Microelectronic and Multichip Module Packaging. Chip Scale Packaging and Direct Chip Attach Technologies. Rigid and Flexible Printed Wiring Boards. Packaging of High Speed and Microwave Electronic Systems. Packaging of High Voltage Electronic Systems.